├── hardware
├── .gitignore
├── v0.2
│ ├── panel
│ │ ├── layout.def
│ │ ├── fabdwg.txt
│ │ ├── Makefile
│ │ └── layout.cfg
│ ├── fab
│ │ ├── eurocircuits.drl
│ │ ├── eurocircuits_png.dru
│ │ ├── eurocircuits_europrint.dru
│ │ └── eurocircuits_verified_4l.dru
│ └── Makefile
├── v0.3
│ ├── panel
│ │ ├── layout.def
│ │ ├── fabdwg.txt
│ │ ├── Makefile
│ │ └── layout.cfg
│ ├── fab
│ │ ├── eurocircuits.drl
│ │ ├── eurocircuits_png.dru
│ │ ├── eurocircuits_europrint.dru
│ │ └── eurocircuits_verified_4l.dru
│ └── Makefile
├── v1.0
│ ├── panel
│ │ ├── fabdwg.txt
│ │ ├── layout.def
│ │ ├── Makefile
│ │ └── layout.cfg
│ ├── fab
│ │ ├── eurocircuits.drl
│ │ ├── eurocircuits_png.dru
│ │ ├── eurocircuits_europrint.dru
│ │ └── eurocircuits_verified_4l.dru
│ ├── Makefile
│ ├── panel_rail.sch
│ └── panel_rail.brd
├── lib
│ ├── misc.lbr
│ └── ftdi.lbr
└── 20pin-adapter
│ ├── 20pin-adapter.brd
│ └── 20pin-adapter-teardrops.brd
├── support
└── crossworks
│ └── FLOSS-JTAG.xml
└── README.md
/hardware/.gitignore:
--------------------------------------------------------------------------------
1 | *.s\#*
2 | *.b\#*
3 |
--------------------------------------------------------------------------------
/hardware/v0.2/panel/layout.def:
--------------------------------------------------------------------------------
1 |
2 | Row {
3 | Col {
4 | flossjtag Rotate
5 | }
6 | Col {
7 | 20pin-adapter
8 | }
9 | }
10 |
--------------------------------------------------------------------------------
/hardware/v0.3/panel/layout.def:
--------------------------------------------------------------------------------
1 |
2 | Row {
3 | Col {
4 | flossjtag Rotate
5 | }
6 | Col {
7 | 20pin-adapter
8 | }
9 | }
10 |
--------------------------------------------------------------------------------
/hardware/v0.2/panel/fabdwg.txt:
--------------------------------------------------------------------------------
1 | * FR4 Material
2 | * 1 oz. copper
3 | * All holes plated through
4 | * Drills shown as finished sizes
5 | * Board thickness 0.062"
6 |
7 |
8 |
--------------------------------------------------------------------------------
/hardware/v0.3/panel/fabdwg.txt:
--------------------------------------------------------------------------------
1 | * FR4 Material
2 | * 1 oz. copper
3 | * All holes plated through
4 | * Drills shown as finished sizes
5 | * Board thickness 0.062"
6 |
7 |
8 |
--------------------------------------------------------------------------------
/hardware/v1.0/panel/fabdwg.txt:
--------------------------------------------------------------------------------
1 | * FR4 Material
2 | * 1 oz. copper
3 | * All holes plated through
4 | * Drills shown as finished sizes
5 | * Board thickness 0.062"
6 |
7 |
8 |
--------------------------------------------------------------------------------
/hardware/v1.0/panel/layout.def:
--------------------------------------------------------------------------------
1 |
2 | Row {
3 | panel_rail
4 | Col {
5 | flossjtag
6 | flossjtag
7 | }
8 | Col {
9 | flossjtag
10 | flossjtag
11 | }
12 | panel_rail
13 | }
14 |
--------------------------------------------------------------------------------
/hardware/v0.2/panel/Makefile:
--------------------------------------------------------------------------------
1 | GERBMERGE = gerbmerge
2 | GERBV = gerbv
3 |
4 | CFG=layout.cfg
5 | DEF=layout.def
6 |
7 | _panel:
8 | cd ..; make gerber
9 | $(GERBMERGE) $(CFG) $(DEF)
10 |
11 |
12 | _view:
13 | $(GERBV) merged.*.ger merged.*.xln
14 |
15 |
16 |
17 | clean:
18 | rm -f merged.* *~
19 |
--------------------------------------------------------------------------------
/hardware/v0.3/panel/Makefile:
--------------------------------------------------------------------------------
1 | GERBMERGE = gerbmerge
2 | GERBV = gerbv
3 |
4 | CFG=layout.cfg
5 | DEF=layout.def
6 |
7 | _panel:
8 | cd ..; make gerber
9 | $(GERBMERGE) $(CFG) $(DEF)
10 |
11 |
12 | _view:
13 | $(GERBV) merged.*.ger merged.*.xln
14 |
15 |
16 |
17 | clean:
18 | rm -f merged.* *~
19 |
--------------------------------------------------------------------------------
/hardware/v1.0/panel/Makefile:
--------------------------------------------------------------------------------
1 | GERBMERGE = gerbmerge
2 | GERBV = gerbv
3 |
4 | CFG=layout.cfg
5 | DEF=layout.def
6 |
7 | _panel:
8 | cd ..; make gerber
9 | $(GERBMERGE) $(CFG) $(DEF)
10 |
11 |
12 | _view:
13 | $(GERBV) merged.*.ger merged.*.xln
14 |
15 |
16 |
17 | clean:
18 | rm -f merged.* *~
19 |
--------------------------------------------------------------------------------
/support/crossworks/FLOSS-JTAG.xml:
--------------------------------------------------------------------------------
1 |
2 |
3 |
4 |
5 |
--------------------------------------------------------------------------------
/hardware/v0.2/fab/eurocircuits.drl:
--------------------------------------------------------------------------------
1 | T01 0.0157in
2 | T02 0.035in
3 | T03 0.042in
4 | T04 0.052in
5 | T05 0.0595in
6 | T06 0.086in
7 | T07 0.125in
8 | T08 0.152in
9 | T09 0.014in
10 | T10 0.032in
11 | T11 0.78in
12 | T12 0.024in
13 | T13 0.0465in
14 | T14 0.036in
15 | T15 0.136in
16 | T16 0.020in
17 | T17 0.032in
18 | T18 0.076in
19 | T19 0.0014in
20 |
--------------------------------------------------------------------------------
/hardware/v0.3/fab/eurocircuits.drl:
--------------------------------------------------------------------------------
1 | T01 0.0157in
2 | T02 0.035in
3 | T03 0.042in
4 | T04 0.052in
5 | T05 0.0595in
6 | T06 0.086in
7 | T07 0.125in
8 | T08 0.152in
9 | T09 0.014in
10 | T10 0.032in
11 | T11 0.78in
12 | T12 0.024in
13 | T13 0.0465in
14 | T14 0.036in
15 | T15 0.136in
16 | T16 0.020in
17 | T17 0.032in
18 | T18 0.076in
19 | T19 0.0014in
20 |
--------------------------------------------------------------------------------
/hardware/v1.0/fab/eurocircuits.drl:
--------------------------------------------------------------------------------
1 | T01 0.0157in
2 | T02 0.035in
3 | T03 0.042in
4 | T04 0.052in
5 | T05 0.0595in
6 | T06 0.086in
7 | T07 0.125in
8 | T08 0.152in
9 | T09 0.014in
10 | T10 0.032in
11 | T11 0.78in
12 | T12 0.024in
13 | T13 0.0465in
14 | T14 0.036in
15 | T15 0.136in
16 | T16 0.020in
17 | T17 0.032in
18 | T18 0.076in
19 | T19 0.0014in
20 |
--------------------------------------------------------------------------------
/README.md:
--------------------------------------------------------------------------------
1 | Free Libre Open-Source/-Hardware JTAG/UART Adapter based on the FT2232H chip.
2 |
3 | The hardware is licensed under Creative Commons Share Alike By Attribution 3.0 (CC-BY-SA 3.0)
4 |
5 | Copyright 2009-2010 Piotr Esden-Tempski
6 |
7 | # UART connector adapter side:
8 |
9 | | Pin No. | Name |
10 | |---------|-------|
11 | | 1 | +3.3V |
12 | | 2 | TXD |
13 | | 3 | RXD |
14 | | 4 | GND |
15 |
16 | The numbering of the connector is from left to right when looking from the edge
17 | of the board at the pins of the header.
18 |
19 | # Hardware design file notes:
20 |
21 | All designs up until version 1.0 of Floss-JTAG were
22 | designed in Cadsoft EAGLE. To view the files you will need to install EAGLE.
23 | Most of the designs are 4-layer; this means that you will need a paid version
24 | of the software to edit the inner layers of the board.
25 |
26 |
27 |
--------------------------------------------------------------------------------
/hardware/v0.2/fab/eurocircuits_png.dru:
--------------------------------------------------------------------------------
1 | description = EAGLE Design Rules\n
\neurocircuits "plot and go" design rules (5B)
2 | layerSetup = (1*16)
3 | mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
4 | mtIsolate = 1.5mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
5 | mdWireWire = 0.2mm
6 | mdWirePad = 0.2mm
7 | mdWireVia = 0.2mm
8 | mdPadPad = 0.2mm
9 | mdPadVia = 0.2mm
10 | mdViaVia = 0.2mm
11 | mdSmdPad = 0.2mm
12 | mdSmdVia = 0.2mm
13 | mdSmdSmd = 0.2mm
14 | mdViaViaSameLayer = 8mil
15 | mnLayersViaInSmd = 2
16 | mdCopperDimension = 40mil
17 | mdDrill = 8mil
18 | mdSmdStop = 0mil
19 | msWidth = 0.2mm
20 | msDrill = 0.35mm
21 | msMicroVia = 35mm
22 | msBlindViaRatio = 0.500000
23 | rvPadTop = 0.250000
24 | rvPadInner = 0.250000
25 | rvPadBottom = 0.250000
26 | rvViaOuter = 0.250000
27 | rvViaInner = 0.250000
28 | rvMicroViaOuter = 0.250000
29 | rvMicroViaInner = 0.250000
30 | rlMinPadTop = 10mil
31 | rlMaxPadTop = 20mil
32 | rlMinPadInner = 10mil
33 | rlMaxPadInner = 20mil
34 | rlMinPadBottom = 10mil
35 | rlMaxPadBottom = 20mil
36 | rlMinViaOuter = 8mil
37 | rlMaxViaOuter = 20mil
38 | rlMinViaInner = 8mil
39 | rlMaxViaInner = 20mil
40 | rlMinMicroViaOuter = 4mil
41 | rlMaxMicroViaOuter = 20mil
42 | rlMinMicroViaInner = 4mil
43 | rlMaxMicroViaInner = 20mil
44 | psTop = -1
45 | psBottom = -1
46 | psFirst = -1
47 | psElongationLong = 100
48 | psElongationOffset = 100
49 | mvStopFrame = 1.000000
50 | mvCreamFrame = 0.000000
51 | mlMinStopFrame = 4mil
52 | mlMaxStopFrame = 4mil
53 | mlMinCreamFrame = 0mil
54 | mlMaxCreamFrame = 0mil
55 | mlViaStopLimit = 0mil
56 | srRoundness = 0.000000
57 | srMinRoundness = 0mil
58 | srMaxRoundness = 0mil
59 | slThermalGap = 0.500000
60 | slMinThermalGap = 20mil
61 | slMaxThermalGap = 100mil
62 | slAnnulusIsolate = 20mil
63 | slThermalIsolate = 10mil
64 | slAnnulusRestring = 0
65 | slThermalRestring = 1
66 | slThermalsForVias = 0
67 | checkGrid = 0
68 | checkAngle = 1
69 | checkFont = 1
70 | checkRestrict = 1
71 | useDiameter = 13
72 | maxErrors = 200
73 |
--------------------------------------------------------------------------------
/hardware/v0.3/fab/eurocircuits_png.dru:
--------------------------------------------------------------------------------
1 | description = EAGLE Design Rules\n
\neurocircuits "plot and go" design rules (5B)
2 | layerSetup = (1*16)
3 | mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
4 | mtIsolate = 1.5mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
5 | mdWireWire = 0.2mm
6 | mdWirePad = 0.2mm
7 | mdWireVia = 0.2mm
8 | mdPadPad = 0.2mm
9 | mdPadVia = 0.2mm
10 | mdViaVia = 0.2mm
11 | mdSmdPad = 0.2mm
12 | mdSmdVia = 0.2mm
13 | mdSmdSmd = 0.2mm
14 | mdViaViaSameLayer = 8mil
15 | mnLayersViaInSmd = 2
16 | mdCopperDimension = 40mil
17 | mdDrill = 8mil
18 | mdSmdStop = 0mil
19 | msWidth = 0.2mm
20 | msDrill = 0.35mm
21 | msMicroVia = 35mm
22 | msBlindViaRatio = 0.500000
23 | rvPadTop = 0.250000
24 | rvPadInner = 0.250000
25 | rvPadBottom = 0.250000
26 | rvViaOuter = 0.250000
27 | rvViaInner = 0.250000
28 | rvMicroViaOuter = 0.250000
29 | rvMicroViaInner = 0.250000
30 | rlMinPadTop = 10mil
31 | rlMaxPadTop = 20mil
32 | rlMinPadInner = 10mil
33 | rlMaxPadInner = 20mil
34 | rlMinPadBottom = 10mil
35 | rlMaxPadBottom = 20mil
36 | rlMinViaOuter = 8mil
37 | rlMaxViaOuter = 20mil
38 | rlMinViaInner = 8mil
39 | rlMaxViaInner = 20mil
40 | rlMinMicroViaOuter = 4mil
41 | rlMaxMicroViaOuter = 20mil
42 | rlMinMicroViaInner = 4mil
43 | rlMaxMicroViaInner = 20mil
44 | psTop = -1
45 | psBottom = -1
46 | psFirst = -1
47 | psElongationLong = 100
48 | psElongationOffset = 100
49 | mvStopFrame = 1.000000
50 | mvCreamFrame = 0.000000
51 | mlMinStopFrame = 4mil
52 | mlMaxStopFrame = 4mil
53 | mlMinCreamFrame = 0mil
54 | mlMaxCreamFrame = 0mil
55 | mlViaStopLimit = 0mil
56 | srRoundness = 0.000000
57 | srMinRoundness = 0mil
58 | srMaxRoundness = 0mil
59 | slThermalGap = 0.500000
60 | slMinThermalGap = 20mil
61 | slMaxThermalGap = 100mil
62 | slAnnulusIsolate = 20mil
63 | slThermalIsolate = 10mil
64 | slAnnulusRestring = 0
65 | slThermalRestring = 1
66 | slThermalsForVias = 0
67 | checkGrid = 0
68 | checkAngle = 1
69 | checkFont = 1
70 | checkRestrict = 1
71 | useDiameter = 13
72 | maxErrors = 200
73 |
--------------------------------------------------------------------------------
/hardware/v1.0/fab/eurocircuits_png.dru:
--------------------------------------------------------------------------------
1 | description = EAGLE Design Rules\n
\neurocircuits "plot and go" design rules (5B)
2 | layerSetup = (1*16)
3 | mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
4 | mtIsolate = 1.5mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
5 | mdWireWire = 0.2mm
6 | mdWirePad = 0.2mm
7 | mdWireVia = 0.2mm
8 | mdPadPad = 0.2mm
9 | mdPadVia = 0.2mm
10 | mdViaVia = 0.2mm
11 | mdSmdPad = 0.2mm
12 | mdSmdVia = 0.2mm
13 | mdSmdSmd = 0.2mm
14 | mdViaViaSameLayer = 8mil
15 | mnLayersViaInSmd = 2
16 | mdCopperDimension = 40mil
17 | mdDrill = 8mil
18 | mdSmdStop = 0mil
19 | msWidth = 0.2mm
20 | msDrill = 0.35mm
21 | msMicroVia = 35mm
22 | msBlindViaRatio = 0.500000
23 | rvPadTop = 0.250000
24 | rvPadInner = 0.250000
25 | rvPadBottom = 0.250000
26 | rvViaOuter = 0.250000
27 | rvViaInner = 0.250000
28 | rvMicroViaOuter = 0.250000
29 | rvMicroViaInner = 0.250000
30 | rlMinPadTop = 10mil
31 | rlMaxPadTop = 20mil
32 | rlMinPadInner = 10mil
33 | rlMaxPadInner = 20mil
34 | rlMinPadBottom = 10mil
35 | rlMaxPadBottom = 20mil
36 | rlMinViaOuter = 8mil
37 | rlMaxViaOuter = 20mil
38 | rlMinViaInner = 8mil
39 | rlMaxViaInner = 20mil
40 | rlMinMicroViaOuter = 4mil
41 | rlMaxMicroViaOuter = 20mil
42 | rlMinMicroViaInner = 4mil
43 | rlMaxMicroViaInner = 20mil
44 | psTop = -1
45 | psBottom = -1
46 | psFirst = -1
47 | psElongationLong = 100
48 | psElongationOffset = 100
49 | mvStopFrame = 1.000000
50 | mvCreamFrame = 0.000000
51 | mlMinStopFrame = 4mil
52 | mlMaxStopFrame = 4mil
53 | mlMinCreamFrame = 0mil
54 | mlMaxCreamFrame = 0mil
55 | mlViaStopLimit = 0mil
56 | srRoundness = 0.000000
57 | srMinRoundness = 0mil
58 | srMaxRoundness = 0mil
59 | slThermalGap = 0.500000
60 | slMinThermalGap = 20mil
61 | slMaxThermalGap = 100mil
62 | slAnnulusIsolate = 20mil
63 | slThermalIsolate = 10mil
64 | slAnnulusRestring = 0
65 | slThermalRestring = 1
66 | slThermalsForVias = 0
67 | checkGrid = 0
68 | checkAngle = 1
69 | checkFont = 1
70 | checkRestrict = 1
71 | useDiameter = 13
72 | maxErrors = 200
73 |
--------------------------------------------------------------------------------
/hardware/v0.2/fab/eurocircuits_europrint.dru:
--------------------------------------------------------------------------------
1 | description = EAGLE Design Rules\n
\neurocircuits "europrint" design rules (6C)
2 | layerSetup = (1*16)
3 | mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
4 | mtIsolate = 1.5mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
5 | mdWireWire = 0.2mm
6 | mdWirePad = 0.2mm
7 | mdWireVia = 0.2mm
8 | mdPadPad = 0.2mm
9 | mdPadVia = 0.2mm
10 | mdViaVia = 0.2mm
11 | mdSmdPad = 0.2mm
12 | mdSmdVia = 0.2mm
13 | mdSmdSmd = 0.2mm
14 | mdViaViaSameLayer = 8mil
15 | mnLayersViaInSmd = 2
16 | mdCopperDimension = 40mil
17 | mdDrill = 8mil
18 | mdSmdStop = 0mil
19 | msWidth = 0.2mm
20 | msDrill = 0.35mm
21 | msMicroVia = 35mm
22 | msBlindViaRatio = 0.500000
23 | rvPadTop = 0.250000
24 | rvPadInner = 0.250000
25 | rvPadBottom = 0.250000
26 | rvViaOuter = 0.250000
27 | rvViaInner = 0.250000
28 | rvMicroViaOuter = 0.250000
29 | rvMicroViaInner = 0.250000
30 | rlMinPadTop = 10mil
31 | rlMaxPadTop = 20mil
32 | rlMinPadInner = 10mil
33 | rlMaxPadInner = 20mil
34 | rlMinPadBottom = 10mil
35 | rlMaxPadBottom = 20mil
36 | rlMinViaOuter = 5mil
37 | rlMaxViaOuter = 20mil
38 | rlMinViaInner = 8mil
39 | rlMaxViaInner = 20mil
40 | rlMinMicroViaOuter = 4mil
41 | rlMaxMicroViaOuter = 20mil
42 | rlMinMicroViaInner = 4mil
43 | rlMaxMicroViaInner = 20mil
44 | psTop = -1
45 | psBottom = -1
46 | psFirst = -1
47 | psElongationLong = 100
48 | psElongationOffset = 100
49 | mvStopFrame = 1.000000
50 | mvCreamFrame = 0.000000
51 | mlMinStopFrame = 4mil
52 | mlMaxStopFrame = 4mil
53 | mlMinCreamFrame = 0mil
54 | mlMaxCreamFrame = 0mil
55 | mlViaStopLimit = 0mil
56 | srRoundness = 0.000000
57 | srMinRoundness = 0mil
58 | srMaxRoundness = 0mil
59 | slThermalGap = 0.500000
60 | slMinThermalGap = 20mil
61 | slMaxThermalGap = 100mil
62 | slAnnulusIsolate = 20mil
63 | slThermalIsolate = 10mil
64 | slAnnulusRestring = 0
65 | slThermalRestring = 1
66 | slThermalsForVias = 0
67 | checkGrid = 0
68 | checkAngle = 1
69 | checkFont = 1
70 | checkRestrict = 1
71 | useDiameter = 13
72 | maxErrors = 200
73 |
--------------------------------------------------------------------------------
/hardware/v0.3/fab/eurocircuits_europrint.dru:
--------------------------------------------------------------------------------
1 | description = EAGLE Design Rules\n
\neurocircuits "europrint" design rules (6C)
2 | layerSetup = (1*16)
3 | mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
4 | mtIsolate = 1.5mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
5 | mdWireWire = 0.2mm
6 | mdWirePad = 0.2mm
7 | mdWireVia = 0.2mm
8 | mdPadPad = 0.2mm
9 | mdPadVia = 0.2mm
10 | mdViaVia = 0.2mm
11 | mdSmdPad = 0.2mm
12 | mdSmdVia = 0.2mm
13 | mdSmdSmd = 0.2mm
14 | mdViaViaSameLayer = 8mil
15 | mnLayersViaInSmd = 2
16 | mdCopperDimension = 40mil
17 | mdDrill = 8mil
18 | mdSmdStop = 0mil
19 | msWidth = 0.2mm
20 | msDrill = 0.35mm
21 | msMicroVia = 35mm
22 | msBlindViaRatio = 0.500000
23 | rvPadTop = 0.250000
24 | rvPadInner = 0.250000
25 | rvPadBottom = 0.250000
26 | rvViaOuter = 0.250000
27 | rvViaInner = 0.250000
28 | rvMicroViaOuter = 0.250000
29 | rvMicroViaInner = 0.250000
30 | rlMinPadTop = 10mil
31 | rlMaxPadTop = 20mil
32 | rlMinPadInner = 10mil
33 | rlMaxPadInner = 20mil
34 | rlMinPadBottom = 10mil
35 | rlMaxPadBottom = 20mil
36 | rlMinViaOuter = 5mil
37 | rlMaxViaOuter = 20mil
38 | rlMinViaInner = 8mil
39 | rlMaxViaInner = 20mil
40 | rlMinMicroViaOuter = 4mil
41 | rlMaxMicroViaOuter = 20mil
42 | rlMinMicroViaInner = 4mil
43 | rlMaxMicroViaInner = 20mil
44 | psTop = -1
45 | psBottom = -1
46 | psFirst = -1
47 | psElongationLong = 100
48 | psElongationOffset = 100
49 | mvStopFrame = 1.000000
50 | mvCreamFrame = 0.000000
51 | mlMinStopFrame = 4mil
52 | mlMaxStopFrame = 4mil
53 | mlMinCreamFrame = 0mil
54 | mlMaxCreamFrame = 0mil
55 | mlViaStopLimit = 0mil
56 | srRoundness = 0.000000
57 | srMinRoundness = 0mil
58 | srMaxRoundness = 0mil
59 | slThermalGap = 0.500000
60 | slMinThermalGap = 20mil
61 | slMaxThermalGap = 100mil
62 | slAnnulusIsolate = 20mil
63 | slThermalIsolate = 10mil
64 | slAnnulusRestring = 0
65 | slThermalRestring = 1
66 | slThermalsForVias = 0
67 | checkGrid = 0
68 | checkAngle = 1
69 | checkFont = 1
70 | checkRestrict = 1
71 | useDiameter = 13
72 | maxErrors = 200
73 |
--------------------------------------------------------------------------------
/hardware/v1.0/fab/eurocircuits_europrint.dru:
--------------------------------------------------------------------------------
1 | description = EAGLE Design Rules\n
\neurocircuits "europrint" design rules (6C)
2 | layerSetup = (1*16)
3 | mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
4 | mtIsolate = 1.5mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
5 | mdWireWire = 0.2mm
6 | mdWirePad = 0.2mm
7 | mdWireVia = 0.2mm
8 | mdPadPad = 0.2mm
9 | mdPadVia = 0.2mm
10 | mdViaVia = 0.2mm
11 | mdSmdPad = 0.2mm
12 | mdSmdVia = 0.2mm
13 | mdSmdSmd = 0.2mm
14 | mdViaViaSameLayer = 8mil
15 | mnLayersViaInSmd = 2
16 | mdCopperDimension = 40mil
17 | mdDrill = 8mil
18 | mdSmdStop = 0mil
19 | msWidth = 0.2mm
20 | msDrill = 0.35mm
21 | msMicroVia = 35mm
22 | msBlindViaRatio = 0.500000
23 | rvPadTop = 0.250000
24 | rvPadInner = 0.250000
25 | rvPadBottom = 0.250000
26 | rvViaOuter = 0.250000
27 | rvViaInner = 0.250000
28 | rvMicroViaOuter = 0.250000
29 | rvMicroViaInner = 0.250000
30 | rlMinPadTop = 10mil
31 | rlMaxPadTop = 20mil
32 | rlMinPadInner = 10mil
33 | rlMaxPadInner = 20mil
34 | rlMinPadBottom = 10mil
35 | rlMaxPadBottom = 20mil
36 | rlMinViaOuter = 5mil
37 | rlMaxViaOuter = 20mil
38 | rlMinViaInner = 8mil
39 | rlMaxViaInner = 20mil
40 | rlMinMicroViaOuter = 4mil
41 | rlMaxMicroViaOuter = 20mil
42 | rlMinMicroViaInner = 4mil
43 | rlMaxMicroViaInner = 20mil
44 | psTop = -1
45 | psBottom = -1
46 | psFirst = -1
47 | psElongationLong = 100
48 | psElongationOffset = 100
49 | mvStopFrame = 1.000000
50 | mvCreamFrame = 0.000000
51 | mlMinStopFrame = 4mil
52 | mlMaxStopFrame = 4mil
53 | mlMinCreamFrame = 0mil
54 | mlMaxCreamFrame = 0mil
55 | mlViaStopLimit = 0mil
56 | srRoundness = 0.000000
57 | srMinRoundness = 0mil
58 | srMaxRoundness = 0mil
59 | slThermalGap = 0.500000
60 | slMinThermalGap = 20mil
61 | slMaxThermalGap = 100mil
62 | slAnnulusIsolate = 20mil
63 | slThermalIsolate = 10mil
64 | slAnnulusRestring = 0
65 | slThermalRestring = 1
66 | slThermalsForVias = 0
67 | checkGrid = 0
68 | checkAngle = 1
69 | checkFont = 1
70 | checkRestrict = 1
71 | useDiameter = 13
72 | maxErrors = 200
73 |
--------------------------------------------------------------------------------
/hardware/v0.2/fab/eurocircuits_verified_4l.dru:
--------------------------------------------------------------------------------
1 | description = EAGLE Design Rules\n
\neurocircuits "verified" 4 layers design rules (6B)
2 | layerSetup = (1*2+15*16)
3 | mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
4 | mtIsolate = 0.2mm 1.5mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
5 | mdWireWire = 0.15mm
6 | mdWirePad = 0.15mm
7 | mdWireVia = 0.15mm
8 | mdPadPad = 0.15mm
9 | mdPadVia = 0.15mm
10 | mdViaVia = 0.15mm
11 | mdSmdPad = 0.15mm
12 | mdSmdVia = 0.15mm
13 | mdSmdSmd = 0.15mm
14 | mdViaViaSameLayer = 8mil
15 | mnLayersViaInSmd = 2
16 | mdCopperDimension = 20mil
17 | mdDrill = 8mil
18 | mdSmdStop = 0mil
19 | msWidth = 0.15mm
20 | msDrill = 0.35mm
21 | msMicroVia = 35mm
22 | msBlindViaRatio = 0.500000
23 | rvPadTop = 0.250000
24 | rvPadInner = 0.250000
25 | rvPadBottom = 0.250000
26 | rvViaOuter = 0.250000
27 | rvViaInner = 0.250000
28 | rvMicroViaOuter = 0.250000
29 | rvMicroViaInner = 0.250000
30 | rlMinPadTop = 0.177mm
31 | rlMaxPadTop = 20mil
32 | rlMinPadInner = 0.235mm
33 | rlMaxPadInner = 20mil
34 | rlMinPadBottom = 0.177mm
35 | rlMaxPadBottom = 20mil
36 | rlMinViaOuter = 0.177mm
37 | rlMaxViaOuter = 20mil
38 | rlMinViaInner = 0.235mm
39 | rlMaxViaInner = 20mil
40 | rlMinMicroViaOuter = 4mil
41 | rlMaxMicroViaOuter = 20mil
42 | rlMinMicroViaInner = 4mil
43 | rlMaxMicroViaInner = 20mil
44 | psTop = -1
45 | psBottom = -1
46 | psFirst = -1
47 | psElongationLong = 100
48 | psElongationOffset = 100
49 | mvStopFrame = 1.000000
50 | mvCreamFrame = 0.000000
51 | mlMinStopFrame = 4mil
52 | mlMaxStopFrame = 4mil
53 | mlMinCreamFrame = 0mil
54 | mlMaxCreamFrame = 0mil
55 | mlViaStopLimit = 0mil
56 | srRoundness = 0.000000
57 | srMinRoundness = 0mil
58 | srMaxRoundness = 0mil
59 | slThermalGap = 0.500000
60 | slMinThermalGap = 20mil
61 | slMaxThermalGap = 100mil
62 | slAnnulusIsolate = 20mil
63 | slThermalIsolate = 10mil
64 | slAnnulusRestring = 0
65 | slThermalRestring = 1
66 | slThermalsForVias = 0
67 | checkGrid = 0
68 | checkAngle = 1
69 | checkFont = 1
70 | checkRestrict = 1
71 | useDiameter = 31
72 | maxErrors = 200
73 |
--------------------------------------------------------------------------------
/hardware/v0.3/fab/eurocircuits_verified_4l.dru:
--------------------------------------------------------------------------------
1 | description = EAGLE Design Rules\n
\neurocircuits "verified" 4 layers design rules (6B)
2 | layerSetup = (1*2+15*16)
3 | mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
4 | mtIsolate = 0.2mm 1.5mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
5 | mdWireWire = 0.15mm
6 | mdWirePad = 0.15mm
7 | mdWireVia = 0.15mm
8 | mdPadPad = 0.15mm
9 | mdPadVia = 0.15mm
10 | mdViaVia = 0.15mm
11 | mdSmdPad = 0.15mm
12 | mdSmdVia = 0.15mm
13 | mdSmdSmd = 0.15mm
14 | mdViaViaSameLayer = 8mil
15 | mnLayersViaInSmd = 2
16 | mdCopperDimension = 20mil
17 | mdDrill = 8mil
18 | mdSmdStop = 0mil
19 | msWidth = 0.15mm
20 | msDrill = 0.35mm
21 | msMicroVia = 35mm
22 | msBlindViaRatio = 0.500000
23 | rvPadTop = 0.250000
24 | rvPadInner = 0.250000
25 | rvPadBottom = 0.250000
26 | rvViaOuter = 0.250000
27 | rvViaInner = 0.250000
28 | rvMicroViaOuter = 0.250000
29 | rvMicroViaInner = 0.250000
30 | rlMinPadTop = 0.177mm
31 | rlMaxPadTop = 20mil
32 | rlMinPadInner = 0.235mm
33 | rlMaxPadInner = 20mil
34 | rlMinPadBottom = 0.177mm
35 | rlMaxPadBottom = 20mil
36 | rlMinViaOuter = 0.177mm
37 | rlMaxViaOuter = 20mil
38 | rlMinViaInner = 0.235mm
39 | rlMaxViaInner = 20mil
40 | rlMinMicroViaOuter = 4mil
41 | rlMaxMicroViaOuter = 20mil
42 | rlMinMicroViaInner = 4mil
43 | rlMaxMicroViaInner = 20mil
44 | psTop = -1
45 | psBottom = -1
46 | psFirst = -1
47 | psElongationLong = 100
48 | psElongationOffset = 100
49 | mvStopFrame = 1.000000
50 | mvCreamFrame = 0.000000
51 | mlMinStopFrame = 4mil
52 | mlMaxStopFrame = 4mil
53 | mlMinCreamFrame = 0mil
54 | mlMaxCreamFrame = 0mil
55 | mlViaStopLimit = 0mil
56 | srRoundness = 0.000000
57 | srMinRoundness = 0mil
58 | srMaxRoundness = 0mil
59 | slThermalGap = 0.500000
60 | slMinThermalGap = 20mil
61 | slMaxThermalGap = 100mil
62 | slAnnulusIsolate = 20mil
63 | slThermalIsolate = 10mil
64 | slAnnulusRestring = 0
65 | slThermalRestring = 1
66 | slThermalsForVias = 0
67 | checkGrid = 0
68 | checkAngle = 1
69 | checkFont = 1
70 | checkRestrict = 1
71 | useDiameter = 31
72 | maxErrors = 200
73 |
--------------------------------------------------------------------------------
/hardware/v1.0/fab/eurocircuits_verified_4l.dru:
--------------------------------------------------------------------------------
1 | description = EAGLE Design Rules\n
\neurocircuits "verified" 4 layers design rules (6B)
2 | layerSetup = (1*2+15*16)
3 | mtCopper = 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm 0.035mm
4 | mtIsolate = 0.2mm 1.5mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm 0.15mm 0.2mm
5 | mdWireWire = 0.15mm
6 | mdWirePad = 0.15mm
7 | mdWireVia = 0.15mm
8 | mdPadPad = 0.15mm
9 | mdPadVia = 0.15mm
10 | mdViaVia = 0.15mm
11 | mdSmdPad = 0.15mm
12 | mdSmdVia = 0.15mm
13 | mdSmdSmd = 0.15mm
14 | mdViaViaSameLayer = 8mil
15 | mnLayersViaInSmd = 2
16 | mdCopperDimension = 20mil
17 | mdDrill = 8mil
18 | mdSmdStop = 0mil
19 | msWidth = 0.15mm
20 | msDrill = 0.35mm
21 | msMicroVia = 35mm
22 | msBlindViaRatio = 0.500000
23 | rvPadTop = 0.250000
24 | rvPadInner = 0.250000
25 | rvPadBottom = 0.250000
26 | rvViaOuter = 0.250000
27 | rvViaInner = 0.250000
28 | rvMicroViaOuter = 0.250000
29 | rvMicroViaInner = 0.250000
30 | rlMinPadTop = 0.177mm
31 | rlMaxPadTop = 20mil
32 | rlMinPadInner = 0.235mm
33 | rlMaxPadInner = 20mil
34 | rlMinPadBottom = 0.177mm
35 | rlMaxPadBottom = 20mil
36 | rlMinViaOuter = 0.177mm
37 | rlMaxViaOuter = 20mil
38 | rlMinViaInner = 0.235mm
39 | rlMaxViaInner = 20mil
40 | rlMinMicroViaOuter = 4mil
41 | rlMaxMicroViaOuter = 20mil
42 | rlMinMicroViaInner = 4mil
43 | rlMaxMicroViaInner = 20mil
44 | psTop = -1
45 | psBottom = -1
46 | psFirst = -1
47 | psElongationLong = 100
48 | psElongationOffset = 100
49 | mvStopFrame = 1.000000
50 | mvCreamFrame = 0.000000
51 | mlMinStopFrame = 4mil
52 | mlMaxStopFrame = 4mil
53 | mlMinCreamFrame = 0mil
54 | mlMaxCreamFrame = 0mil
55 | mlViaStopLimit = 0mil
56 | srRoundness = 0.000000
57 | srMinRoundness = 0mil
58 | srMaxRoundness = 0mil
59 | slThermalGap = 0.500000
60 | slMinThermalGap = 20mil
61 | slMaxThermalGap = 100mil
62 | slAnnulusIsolate = 20mil
63 | slThermalIsolate = 10mil
64 | slAnnulusRestring = 0
65 | slThermalRestring = 1
66 | slThermalsForVias = 0
67 | checkGrid = 0
68 | checkAngle = 1
69 | checkFont = 1
70 | checkRestrict = 1
71 | useDiameter = 31
72 | maxErrors = 200
73 |
--------------------------------------------------------------------------------
/hardware/v0.2/panel/layout.cfg:
--------------------------------------------------------------------------------
1 | [DEFAULT]
2 | # Change projdir to wherever your project files are, for example:
3 | # projdir = /home/stuff/projects/test
4 | #
5 | # or relative pathname from where you are running GerbMerge
6 | #
7 | # projdir = testdata
8 | #
9 | projdir=.
10 |
11 | [Options]
12 |
13 | # Set the inter-job spacing (inches)
14 | # 0.0787 ~= 2mm
15 | XSpacing=0.0787
16 | YSpacing=0.0787
17 |
18 | #PanelWidth = 3.28
19 | #PanelHeight = 4.17
20 |
21 | # Which layers to draw cut lines on. Omit this option
22 | # or set to 'None' for no cut lines. We don't want silkscreens
23 | # in this job so put cut lines and crop marks on copper layers.
24 | # NOTE: Layer names are ALL LOWERCASE, even if you define them
25 | # with uppercase letters below.
26 | #CutLineLayers = None
27 | CutLineLayers = *toplayer,*bottomlayer
28 |
29 | # Which layers to draw crop marks on. Omit this option
30 | # or set to 'None' for no crop marks.
31 | # NOTE: Layer names are ALL LOWERCASE, even if you define them
32 | # with uppercase letters below.
33 | CropMarkLayers = *toplayer,*bottomlayer
34 |
35 | # Mandatory option indicating name of file that maps Excellon
36 | # tool codes to drill sizes.
37 | ToolList=%(projdir)s/../fab/eurocircuits.drl
38 |
39 | # Must set this option since we are combining jobs with missing
40 | # layers names. That is, Hexapod just has copper, while we do want
41 | # to print soldermasks for Proj1.
42 | AllowMissingLayers = 1
43 |
44 | # Set to 1 to create a fabrication drawing
45 | FabricationDrawingFile = merged.fabdrawing.ger
46 |
47 | # Filename where optional additional text is to be added to fabrication
48 | # drawing.
49 | FabricationDrawingText = %(projdir)s/fabdwg.txt
50 |
51 | LeftMargin = 0
52 | RightMargin = 0
53 | TopMargin = 0
54 | BottomMargin = 0
55 |
56 |
57 | [flossjtag]
58 | Prefix = %(projdir)s/../flossjtag-teardrops
59 | *TopLayer=%(prefix)s.cmp
60 | *BottomLayer=%(prefix)s.sol
61 | *TopSoldermask=%(prefix)s.stc
62 | *BottomSoldermask=%(prefix)s.sts
63 | *TopSilkscreen=%(prefix)s.plc
64 | *InnerTopLayer=%(prefix)s.l02
65 | *InnerBotLayer=%(prefix)s.l15
66 | Drills=%(prefix)s.xln
67 | BoardOutline=%(prefix)s.bor
68 |
69 | [20pin-adapter]
70 | Prefix = %(projdir)s/../../20pin-adapter/20pin-adapter-teardrops
71 | *TopLayer=%(prefix)s.cmp
72 | *BottomLayer=%(prefix)s.sol
73 | *TopSoldermask=%(prefix)s.stc
74 | *BottomSoldermask=%(prefix)s.sts
75 | *TopSilkscreen=%(prefix)s.plc
76 | *InnerTopLayer=%(prefix)s.l02
77 | *InnerBotLayer=%(prefix)s.l15
78 | Drills=%(prefix)s.xln
79 | BoardOutline=%(prefix)s.bor
80 |
--------------------------------------------------------------------------------
/hardware/v0.3/panel/layout.cfg:
--------------------------------------------------------------------------------
1 | [DEFAULT]
2 | # Change projdir to wherever your project files are, for example:
3 | # projdir = /home/stuff/projects/test
4 | #
5 | # or relative pathname from where you are running GerbMerge
6 | #
7 | # projdir = testdata
8 | #
9 | projdir=.
10 |
11 | [Options]
12 |
13 | # Set the inter-job spacing (inches)
14 | # 0.0787 ~= 2mm
15 | XSpacing=0.0787
16 | YSpacing=0.0787
17 |
18 | #PanelWidth = 3.28
19 | #PanelHeight = 4.17
20 |
21 | # Which layers to draw cut lines on. Omit this option
22 | # or set to 'None' for no cut lines. We don't want silkscreens
23 | # in this job so put cut lines and crop marks on copper layers.
24 | # NOTE: Layer names are ALL LOWERCASE, even if you define them
25 | # with uppercase letters below.
26 | #CutLineLayers = None
27 | CutLineLayers = *toplayer,*bottomlayer
28 |
29 | # Which layers to draw crop marks on. Omit this option
30 | # or set to 'None' for no crop marks.
31 | # NOTE: Layer names are ALL LOWERCASE, even if you define them
32 | # with uppercase letters below.
33 | CropMarkLayers = *toplayer,*bottomlayer
34 |
35 | # Mandatory option indicating name of file that maps Excellon
36 | # tool codes to drill sizes.
37 | ToolList=%(projdir)s/../fab/eurocircuits.drl
38 |
39 | # Must set this option since we are combining jobs with missing
40 | # layers names. That is, Hexapod just has copper, while we do want
41 | # to print soldermasks for Proj1.
42 | AllowMissingLayers = 1
43 |
44 | # Set to 1 to create a fabrication drawing
45 | FabricationDrawingFile = merged.fabdrawing.ger
46 |
47 | # Filename where optional additional text is to be added to fabrication
48 | # drawing.
49 | FabricationDrawingText = %(projdir)s/fabdwg.txt
50 |
51 | LeftMargin = 0
52 | RightMargin = 0
53 | TopMargin = 0
54 | BottomMargin = 0
55 |
56 |
57 | [flossjtag]
58 | Prefix = %(projdir)s/../flossjtag-teardrops
59 | *TopLayer=%(prefix)s.cmp
60 | *BottomLayer=%(prefix)s.sol
61 | *TopSoldermask=%(prefix)s.stc
62 | *BottomSoldermask=%(prefix)s.sts
63 | *TopSilkscreen=%(prefix)s.plc
64 | *InnerTopLayer=%(prefix)s.l02
65 | *InnerBotLayer=%(prefix)s.l15
66 | Drills=%(prefix)s.xln
67 | BoardOutline=%(prefix)s.bor
68 |
69 | [20pin-adapter]
70 | Prefix = %(projdir)s/../../20pin-adapter/20pin-adapter-teardrops
71 | *TopLayer=%(prefix)s.cmp
72 | *BottomLayer=%(prefix)s.sol
73 | *TopSoldermask=%(prefix)s.stc
74 | *BottomSoldermask=%(prefix)s.sts
75 | *TopSilkscreen=%(prefix)s.plc
76 | *InnerTopLayer=%(prefix)s.l02
77 | *InnerBotLayer=%(prefix)s.l15
78 | Drills=%(prefix)s.xln
79 | BoardOutline=%(prefix)s.bor
80 |
--------------------------------------------------------------------------------
/hardware/v1.0/panel/layout.cfg:
--------------------------------------------------------------------------------
1 | [DEFAULT]
2 | # Change projdir to wherever your project files are, for example:
3 | # projdir = /home/stuff/projects/test
4 | #
5 | # or relative pathname from where you are running GerbMerge
6 | #
7 | # projdir = testdata
8 | #
9 | projdir=.
10 |
11 | [Options]
12 |
13 | # Set the inter-job spacing (inches)
14 | # 0.0787 ~= 2mm
15 | XSpacing=0.0787
16 | YSpacing=0.0787
17 |
18 | #PanelWidth = 3.28
19 | #PanelHeight = 4.17
20 |
21 | # Which layers to draw cut lines on. Omit this option
22 | # or set to 'None' for no cut lines. We don't want silkscreens
23 | # in this job so put cut lines and crop marks on copper layers.
24 | # NOTE: Layer names are ALL LOWERCASE, even if you define them
25 | # with uppercase letters below.
26 | #CutLineLayers = None
27 | CutLineLayers = *toplayer,*bottomlayer
28 |
29 | # Which layers to draw crop marks on. Omit this option
30 | # or set to 'None' for no crop marks.
31 | # NOTE: Layer names are ALL LOWERCASE, even if you define them
32 | # with uppercase letters below.
33 | CropMarkLayers = *toplayer,*bottomlayer
34 |
35 | # Mandatory option indicating name of file that maps Excellon
36 | # tool codes to drill sizes.
37 | ToolList=%(projdir)s/../fab/eurocircuits.drl
38 |
39 | # Must set this option since we are combining jobs with missing
40 | # layers names. That is, Hexapod just has copper, while we do want
41 | # to print soldermasks for Proj1.
42 | AllowMissingLayers = 1
43 |
44 | # Set to 1 to create a fabrication drawing
45 | FabricationDrawingFile = merged.fabdrawing.ger
46 |
47 | # Filename where optional additional text is to be added to fabrication
48 | # drawing.
49 | FabricationDrawingText = %(projdir)s/fabdwg.txt
50 |
51 | LeftMargin = 0
52 | RightMargin = 0
53 | TopMargin = 0
54 | BottomMargin = 0
55 |
56 |
57 | [flossjtag]
58 | Prefix = %(projdir)s/../flossjtag-teardrops
59 | *TopLayer=%(prefix)s.cmp
60 | *BottomLayer=%(prefix)s.sol
61 | *TopSoldermask=%(prefix)s.stc
62 | *BottomSoldermask=%(prefix)s.sts
63 | *TopSilkscreen=%(prefix)s.plc
64 | *BottomSilkscreen=%(prefix)s.pls
65 | *InnerTopLayer=%(prefix)s.l02
66 | *InnerBotLayer=%(prefix)s.l15
67 | Drills=%(prefix)s.xln
68 | BoardOutline=%(prefix)s.bor
69 |
70 | [panel_rail]
71 | Prefix = %(projdir)s/../panel_rail
72 | *TopLayer=%(prefix)s.cmp
73 | *BottomLayer=%(prefix)s.sol
74 | *TopSoldermask=%(prefix)s.stc
75 | *BottomSoldermask=%(prefix)s.sts
76 | *TopSilkscreen=%(prefix)s.plc
77 | *BottomSilkscreen=%(prefix)s.pls
78 | *InnerTopLayer=%(prefix)s.l02
79 | *InnerBotLayer=%(prefix)s.l15
80 | Drills=%(prefix)s.xln
81 | BoardOutline=%(prefix)s.bor
82 |
--------------------------------------------------------------------------------
/hardware/v0.2/Makefile:
--------------------------------------------------------------------------------
1 | #
2 | # Floss JTAG - Open Hardware JTAG adapter
3 | # Copyright (c) 2009 Piotr Esden-Tempski
4 | #
5 | # Redistribution and use in source and binary forms, with or without
6 | # modification, are permitted provided that the following conditions
7 | # are met:
8 | # 1. Redistributions of source code must retain the above copyright
9 | # notice, this list of conditions and the following disclaimer.
10 | # 2. Redistributions in binary form must reproduce the above copyright
11 | # notice, this list of conditions and the following disclaimer in the
12 | # documentation and/or other materials provided with the distribution.
13 | # 3. The name of the author may not be used to endorse or promote products
14 | # derived from this software without specific prior written permission.
15 | #
16 | # THIS SOFTWARE IS PROVIDED BY THE AUTHOR ``AS IS'' AND ANY EXPRESS OR
17 | # IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
18 | # OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE DISCLAIMED.
19 | # IN NO EVENT SHALL THE AUTHOR BE LIABLE FOR ANY DIRECT, INDIRECT,
20 | # INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT
21 | # NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE,
22 | # DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY
23 | # THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT
24 | # (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF
25 | # THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
26 | #
27 |
28 | BRD_SRCS = flossjtag-teardrops.brd \
29 | ../20pin-adapter/20pin-adapter-teardrops.brd
30 |
31 | DIRS =
32 |
33 | ##### This substitutions work only with EXACTLY ONE level of subdirectory !!!!!
34 | SCHEMATICS=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.schematics.ps))
35 | TOP_LAYER=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.top_layer.ps))
36 | TOP_COMP=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.top_comp.ps))
37 | BOTTOM_LAYER=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.bottom_layer.ps))
38 | BOTTOM_COMP=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.bottom_comp.ps))
39 | POSTSCRIPTS= $(SCHEMATICS) $(TOP_LAYER) $(TOP_COMP) $(BOTTOM_LAYER) $(BOTTOM_COMP)
40 | PDF=$(POSTSCRIPTS:%.ps=%.pdf)
41 |
42 |
43 | GERB_O = $(BRD_SRCS:.brd=.all)
44 |
45 | all: gerber
46 |
47 | gerber: $(GERB_O)
48 |
49 | printable: dirs $(POSTSCRIPTS) $(PDF)
50 |
51 | dirs :
52 | mkdir -p $(DIRS:%=%/printable)
53 |
54 |
55 | ### GERBER GENERATION
56 |
57 | .PRECIOUS : %.cmp %.sol %.stc %.sts %.plc %.bor %.xln %.l02 %.l15
58 |
59 | %.all: %.cmp %.sol %.stc %.sts %.plc %.xln %.bor %.l02 %.l15
60 | touch $@
61 |
62 | # Component side
63 | %.cmp : %.brd
64 | eagle -X -N -d GERBER_RS274X -o $@ $< Top Pads Vias
65 | # Solder side
66 | %.sol : %.brd
67 | eagle -X -N -d GERBER_RS274X -o $@ $< Bottom Pads Vias
68 | # Solder stop mask comp. side
69 | %.stc : %.brd
70 | eagle -X -N -d GERBER_RS274X -o $@ $< tStop
71 | # Solder stop mask sold. side
72 | %.sts : %.brd
73 | eagle -X -N -d GERBER_RS274X -o $@ $< bStop
74 | # Silkscreen comp. side
75 | %.plc : %.brd
76 | eagle -X -N -d GERBER_RS274X -o $@ $< Dimension tPlace tDocu
77 | # Drill data for NC drill st.
78 | # warning : eagle takes path of -R option from input file directory.
79 | %.xln : %.brd
80 | eagle -X -N -d EXCELLON -E -0.02 -E 0.1 -R fab/eurocircuits.drl -o $@ $< Drills Holes
81 | # Outline
82 | %.bor : %.brd
83 | eagle -X -N -d GERBER_RS274X -o $@ $< Dimension
84 | # Inner layer top
85 | %.l02 : %.brd
86 | eagle -X -N -d GERBER_RS274X -o $@ $< Route2 Pads Vias
87 | # Inner layer bot
88 | %.l15 : %.brd
89 | eagle -X -N -d GERBER_RS274X -o $@ $< Route15 Pads Vias
90 |
91 |
92 | ### POSTSCRIPT AND PDF GENERATION
93 |
94 |
95 | %.pdf : %.ps
96 | ps2pdf $< $@
97 |
98 | %.schematics.ps : ../%.sch
99 | eagle -X -N -d PS -x.4 -y.2 -o $@ $< Nets Busses Symbols Names Values
100 |
101 | %.top_layer.ps : ../%.brd
102 | eagle -X -N -f- -m+ -d PS -h2 -w3 -o $@ $< Top Pad Via Dimension
103 |
104 | %.top_comp.ps : ../%.brd
105 | eagle -X -N -f- -d PS -h2 -w2 -o $@ $< Pad Via Dimension tPlace tNames tDocu
106 |
107 | %.bottom_layer.ps : ../%.brd
108 | eagle -X -N -f- -d PS -h2 -w3 -o $@ $< Bottom Pad Via Dimension
109 |
110 | %.bottom_comp.ps : ../%.brd
111 | eagle -X -N -f- -m+ -c -d PS -h2 -w2 -o $@ $< Pad Via Dimension bPlace bNames bDocu
112 |
113 |
114 | clean:
115 | @# gerber and excellon
116 | find .. -name '*.cmp' -exec rm -f {} \;
117 | find .. -name '*.sol' -exec rm -f {} \;
118 | find .. -name '*.stc' -exec rm -f {} \;
119 | find .. -name '*.sts' -exec rm -f {} \;
120 | find .. -name '*.plc' -exec rm -f {} \;
121 | find .. -name '*.bor' -exec rm -f {} \;
122 | find .. -name '*.xln' -exec rm -f {} \;
123 | find .. -name '*.dri' -exec rm -f {} \;
124 | find .. -name '*.gpi' -exec rm -f {} \;
125 | find .. -name '*.l02' -exec rm -f {} \;
126 | find .. -name '*.l15' -exec rm -f {} \;
127 | find .. -name '*.all' -exec rm -f {} \;
128 | @# printable
129 | find . -name '*.schematics.ps' -exec rm -f {} \;
130 | find . -name '*.schematics.pdf' -exec rm -f {} \;
131 | find . -name '*.top_layer.ps' -exec rm -f {} \;
132 | find . -name '*.top_layer.pdf' -exec rm -f {} \;
133 | find . -name '*.top_comp.ps' -exec rm -f {} \;
134 | find . -name '*.top_comp.pdf' -exec rm -f {} \;
135 | find . -name '*.bottom_layer.ps' -exec rm -f {} \;
136 | find . -name '*.bottom_layer.pdf' -exec rm -f {} \;
137 | find . -name '*.bottom_comp.ps' -exec rm -f {} \;
138 | find . -name '*.bottom_comp.pdf' -exec rm -f {} \;
139 | @# eagle error log
140 | find .. -name '*.erc' -exec rm -f {} \;
141 | @# eagle autorouter log
142 | find .. -name '*.pro' -exec rm -f {} \;
143 | @# eagle backups
144 | find .. -name '*#*' -exec rm -f {} \;
145 | @# emacs backups
146 | find .. -name '*~' -exec rm -f {} \;
147 |
--------------------------------------------------------------------------------
/hardware/v0.3/Makefile:
--------------------------------------------------------------------------------
1 | #
2 | # Floss JTAG - Open Hardware JTAG adapter
3 | # Copyright (c) 2009 Piotr Esden-Tempski
4 | #
5 | # Redistribution and use in source and binary forms, with or without
6 | # modification, are permitted provided that the following conditions
7 | # are met:
8 | # 1. Redistributions of source code must retain the above copyright
9 | # notice, this list of conditions and the following disclaimer.
10 | # 2. Redistributions in binary form must reproduce the above copyright
11 | # notice, this list of conditions and the following disclaimer in the
12 | # documentation and/or other materials provided with the distribution.
13 | # 3. The name of the author may not be used to endorse or promote products
14 | # derived from this software without specific prior written permission.
15 | #
16 | # THIS SOFTWARE IS PROVIDED BY THE AUTHOR ``AS IS'' AND ANY EXPRESS OR
17 | # IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
18 | # OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE DISCLAIMED.
19 | # IN NO EVENT SHALL THE AUTHOR BE LIABLE FOR ANY DIRECT, INDIRECT,
20 | # INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT
21 | # NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE,
22 | # DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY
23 | # THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT
24 | # (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF
25 | # THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
26 | #
27 |
28 | BRD_SRCS = flossjtag-teardrops.brd \
29 | ../20pin-adapter/20pin-adapter-teardrops.brd
30 |
31 | DIRS =
32 |
33 | ##### This substitutions work only with EXACTLY ONE level of subdirectory !!!!!
34 | SCHEMATICS=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.schematics.ps))
35 | TOP_LAYER=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.top_layer.ps))
36 | TOP_COMP=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.top_comp.ps))
37 | BOTTOM_LAYER=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.bottom_layer.ps))
38 | BOTTOM_COMP=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.bottom_comp.ps))
39 | POSTSCRIPTS= $(SCHEMATICS) $(TOP_LAYER) $(TOP_COMP) $(BOTTOM_LAYER) $(BOTTOM_COMP)
40 | PDF=$(POSTSCRIPTS:%.ps=%.pdf)
41 |
42 |
43 | GERB_O = $(BRD_SRCS:.brd=.all)
44 |
45 | all: gerber
46 |
47 | gerber: $(GERB_O)
48 |
49 | printable: dirs $(POSTSCRIPTS) $(PDF)
50 |
51 | dirs :
52 | mkdir -p $(DIRS:%=%/printable)
53 |
54 |
55 | ### GERBER GENERATION
56 |
57 | .PRECIOUS : %.cmp %.sol %.stc %.sts %.plc %.bor %.xln %.l02 %.l15
58 |
59 | %.all: %.cmp %.sol %.stc %.sts %.plc %.xln %.bor %.l02 %.l15
60 | touch $@
61 |
62 | # Component side
63 | %.cmp : %.brd
64 | eagle -X -N -d GERBER_RS274X -o $@ $< Top Pads Vias
65 | # Solder side
66 | %.sol : %.brd
67 | eagle -X -N -d GERBER_RS274X -o $@ $< Bottom Pads Vias
68 | # Solder stop mask comp. side
69 | %.stc : %.brd
70 | eagle -X -N -d GERBER_RS274X -o $@ $< tStop
71 | # Solder stop mask sold. side
72 | %.sts : %.brd
73 | eagle -X -N -d GERBER_RS274X -o $@ $< bStop
74 | # Silkscreen comp. side
75 | %.plc : %.brd
76 | eagle -X -N -d GERBER_RS274X -o $@ $< Dimension tPlace tDocu
77 | # Drill data for NC drill st.
78 | # warning : eagle takes path of -R option from input file directory.
79 | %.xln : %.brd
80 | eagle -X -N -d EXCELLON -E -0.02 -E 0.1 -R fab/eurocircuits.drl -o $@ $< Drills Holes
81 | # Outline
82 | %.bor : %.brd
83 | eagle -X -N -d GERBER_RS274X -o $@ $< Dimension
84 | # Inner layer top
85 | %.l02 : %.brd
86 | eagle -X -N -d GERBER_RS274X -o $@ $< Route2 Pads Vias
87 | # Inner layer bot
88 | %.l15 : %.brd
89 | eagle -X -N -d GERBER_RS274X -o $@ $< Route15 Pads Vias
90 |
91 |
92 | ### POSTSCRIPT AND PDF GENERATION
93 |
94 |
95 | %.pdf : %.ps
96 | ps2pdf $< $@
97 |
98 | %.schematics.ps : ../%.sch
99 | eagle -X -N -d PS -x.4 -y.2 -o $@ $< Nets Busses Symbols Names Values
100 |
101 | %.top_layer.ps : ../%.brd
102 | eagle -X -N -f- -m+ -d PS -h2 -w3 -o $@ $< Top Pad Via Dimension
103 |
104 | %.top_comp.ps : ../%.brd
105 | eagle -X -N -f- -d PS -h2 -w2 -o $@ $< Pad Via Dimension tPlace tNames tDocu
106 |
107 | %.bottom_layer.ps : ../%.brd
108 | eagle -X -N -f- -d PS -h2 -w3 -o $@ $< Bottom Pad Via Dimension
109 |
110 | %.bottom_comp.ps : ../%.brd
111 | eagle -X -N -f- -m+ -c -d PS -h2 -w2 -o $@ $< Pad Via Dimension bPlace bNames bDocu
112 |
113 |
114 | clean:
115 | @# gerber and excellon
116 | find .. -name '*.cmp' -exec rm -f {} \;
117 | find .. -name '*.sol' -exec rm -f {} \;
118 | find .. -name '*.stc' -exec rm -f {} \;
119 | find .. -name '*.sts' -exec rm -f {} \;
120 | find .. -name '*.plc' -exec rm -f {} \;
121 | find .. -name '*.bor' -exec rm -f {} \;
122 | find .. -name '*.xln' -exec rm -f {} \;
123 | find .. -name '*.dri' -exec rm -f {} \;
124 | find .. -name '*.gpi' -exec rm -f {} \;
125 | find .. -name '*.l02' -exec rm -f {} \;
126 | find .. -name '*.l15' -exec rm -f {} \;
127 | find .. -name '*.all' -exec rm -f {} \;
128 | @# printable
129 | find . -name '*.schematics.ps' -exec rm -f {} \;
130 | find . -name '*.schematics.pdf' -exec rm -f {} \;
131 | find . -name '*.top_layer.ps' -exec rm -f {} \;
132 | find . -name '*.top_layer.pdf' -exec rm -f {} \;
133 | find . -name '*.top_comp.ps' -exec rm -f {} \;
134 | find . -name '*.top_comp.pdf' -exec rm -f {} \;
135 | find . -name '*.bottom_layer.ps' -exec rm -f {} \;
136 | find . -name '*.bottom_layer.pdf' -exec rm -f {} \;
137 | find . -name '*.bottom_comp.ps' -exec rm -f {} \;
138 | find . -name '*.bottom_comp.pdf' -exec rm -f {} \;
139 | @# eagle error log
140 | find .. -name '*.erc' -exec rm -f {} \;
141 | @# eagle autorouter log
142 | find .. -name '*.pro' -exec rm -f {} \;
143 | @# eagle backups
144 | find .. -name '*#*' -exec rm -f {} \;
145 | @# emacs backups
146 | find .. -name '*~' -exec rm -f {} \;
147 |
--------------------------------------------------------------------------------
/hardware/v1.0/Makefile:
--------------------------------------------------------------------------------
1 | #
2 | # Floss JTAG - Open Hardware JTAG adapter
3 | # Copyright (c) 2009 Piotr Esden-Tempski
4 | #
5 | # Redistribution and use in source and binary forms, with or without
6 | # modification, are permitted provided that the following conditions
7 | # are met:
8 | # 1. Redistributions of source code must retain the above copyright
9 | # notice, this list of conditions and the following disclaimer.
10 | # 2. Redistributions in binary form must reproduce the above copyright
11 | # notice, this list of conditions and the following disclaimer in the
12 | # documentation and/or other materials provided with the distribution.
13 | # 3. The name of the author may not be used to endorse or promote products
14 | # derived from this software without specific prior written permission.
15 | #
16 | # THIS SOFTWARE IS PROVIDED BY THE AUTHOR ``AS IS'' AND ANY EXPRESS OR
17 | # IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
18 | # OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE DISCLAIMED.
19 | # IN NO EVENT SHALL THE AUTHOR BE LIABLE FOR ANY DIRECT, INDIRECT,
20 | # INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT
21 | # NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE,
22 | # DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY
23 | # THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT
24 | # (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF
25 | # THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
26 | #
27 |
28 | BRD_SRCS = flossjtag-teardrops.brd \
29 | panel_rail.brd
30 |
31 | DIRS =
32 |
33 | ##### This substitutions work only with EXACTLY ONE level of subdirectory !!!!!
34 | SCHEMATICS=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.schematics.ps))
35 | TOP_LAYER=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.top_layer.ps))
36 | TOP_COMP=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.top_comp.ps))
37 | BOTTOM_LAYER=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.bottom_layer.ps))
38 | BOTTOM_COMP=$(subst /,/printable/,$(BRD_SRCS:%.brd=%.bottom_comp.ps))
39 | POSTSCRIPTS= $(SCHEMATICS) $(TOP_LAYER) $(TOP_COMP) $(BOTTOM_LAYER) $(BOTTOM_COMP)
40 | PDF=$(POSTSCRIPTS:%.ps=%.pdf)
41 |
42 |
43 | GERB_O = $(BRD_SRCS:.brd=.all)
44 |
45 | all: gerber
46 |
47 | gerber: $(GERB_O)
48 |
49 | printable: dirs $(POSTSCRIPTS) $(PDF)
50 |
51 | dirs :
52 | mkdir -p $(DIRS:%=%/printable)
53 |
54 |
55 | ### GERBER GENERATION
56 |
57 | .PRECIOUS : %.cmp %.sol %.stc %.sts %.plc %.pls %.bor %.xln %.l02 %.l15
58 |
59 | %.all: %.cmp %.sol %.stc %.sts %.plc %.pls %.xln %.bor %.l02 %.l15
60 | touch $@
61 |
62 | # Component side
63 | %.cmp : %.brd
64 | eagle -X -N -d GERBER_RS274X -o $@ $< Top Pads Vias
65 | # Solder side
66 | %.sol : %.brd
67 | eagle -X -N -d GERBER_RS274X -o $@ $< Bottom Pads Vias
68 | # Solder stop mask comp. side
69 | %.stc : %.brd
70 | eagle -X -N -d GERBER_RS274X -o $@ $< tStop
71 | # Solder stop mask sold. side
72 | %.sts : %.brd
73 | eagle -X -N -d GERBER_RS274X -o $@ $< bStop
74 | # Silkscreen comp. side
75 | %.plc : %.brd
76 | eagle -X -N -d GERBER_RS274X -o $@ $< Dimension tPlace
77 | # Silkscreen solder. side
78 | %.pls : %.brd
79 | eagle -X -N -d GERBER_RS274X -o $@ $< Dimension bPlace
80 | # Drill data for NC drill st.
81 | # warning : eagle takes path of -R option from input file directory.
82 | %.xln : %.brd
83 | eagle -X -N -d EXCELLON -E -0.02 -E 0.1 -R fab/eurocircuits.drl -o $@ $< Drills Holes
84 | # Outline
85 | %.bor : %.brd
86 | eagle -X -N -d GERBER_RS274X -o $@ $< Dimension
87 | # Inner layer top
88 | %.l02 : %.brd
89 | eagle -X -N -d GERBER_RS274X -o $@ $< Route2 Pads Vias
90 | # Inner layer bot
91 | %.l15 : %.brd
92 | eagle -X -N -d GERBER_RS274X -o $@ $< Route15 Pads Vias
93 |
94 |
95 | ### POSTSCRIPT AND PDF GENERATION
96 |
97 |
98 | %.pdf : %.ps
99 | ps2pdf $< $@
100 |
101 | %.schematics.ps : ../%.sch
102 | eagle -X -N -d PS -x.4 -y.2 -o $@ $< Nets Busses Symbols Names Values
103 |
104 | %.top_layer.ps : ../%.brd
105 | eagle -X -N -f- -m+ -d PS -h2 -w3 -o $@ $< Top Pad Via Dimension
106 |
107 | %.top_comp.ps : ../%.brd
108 | eagle -X -N -f- -d PS -h2 -w2 -o $@ $< Pad Via Dimension tPlace tNames tDocu
109 |
110 | %.bottom_layer.ps : ../%.brd
111 | eagle -X -N -f- -d PS -h2 -w3 -o $@ $< Bottom Pad Via Dimension
112 |
113 | %.bottom_comp.ps : ../%.brd
114 | eagle -X -N -f- -m+ -c -d PS -h2 -w2 -o $@ $< Pad Via Dimension bPlace bNames bDocu
115 |
116 |
117 | clean:
118 | @# gerber and excellon
119 | find .. -name '*.cmp' -exec rm -f {} \;
120 | find .. -name '*.sol' -exec rm -f {} \;
121 | find .. -name '*.stc' -exec rm -f {} \;
122 | find .. -name '*.sts' -exec rm -f {} \;
123 | find .. -name '*.plc' -exec rm -f {} \;
124 | find .. -name '*.pls' -exec rm -f {} \;
125 | find .. -name '*.bor' -exec rm -f {} \;
126 | find .. -name '*.xln' -exec rm -f {} \;
127 | find .. -name '*.dri' -exec rm -f {} \;
128 | find .. -name '*.gpi' -exec rm -f {} \;
129 | find .. -name '*.l02' -exec rm -f {} \;
130 | find .. -name '*.l15' -exec rm -f {} \;
131 | find .. -name '*.all' -exec rm -f {} \;
132 | @# printable
133 | find . -name '*.schematics.ps' -exec rm -f {} \;
134 | find . -name '*.schematics.pdf' -exec rm -f {} \;
135 | find . -name '*.top_layer.ps' -exec rm -f {} \;
136 | find . -name '*.top_layer.pdf' -exec rm -f {} \;
137 | find . -name '*.top_comp.ps' -exec rm -f {} \;
138 | find . -name '*.top_comp.pdf' -exec rm -f {} \;
139 | find . -name '*.bottom_layer.ps' -exec rm -f {} \;
140 | find . -name '*.bottom_layer.pdf' -exec rm -f {} \;
141 | find . -name '*.bottom_comp.ps' -exec rm -f {} \;
142 | find . -name '*.bottom_comp.pdf' -exec rm -f {} \;
143 | @# eagle error log
144 | find .. -name '*.erc' -exec rm -f {} \;
145 | @# eagle autorouter log
146 | find .. -name '*.pro' -exec rm -f {} \;
147 | @# eagle backups
148 | find .. -name '*#*' -exec rm -f {} \;
149 | @# emacs backups
150 | find .. -name '*~' -exec rm -f {} \;
151 |
--------------------------------------------------------------------------------
/hardware/v1.0/panel_rail.sch:
--------------------------------------------------------------------------------
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120 | <b>Fiducial Alignment Points</b>
121 | Various fiducial points for machine vision alignment.
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/hardware/v1.0/panel_rail.brd:
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121 | <b>EAGLE Design Rules</b>
122 | <p>
123 | Die Standard-Design-Rules sind so gewählt, dass sie für
124 | die meisten Anwendungen passen. Sollte ihre Platine
125 | besondere Anforderungen haben, treffen Sie die erforderlichen
126 | Einstellungen hier und speichern die Design Rules unter
127 | einem neuen Namen ab.
128 | <b>EAGLE Design Rules</b>
129 | <p>
130 | The default Design Rules have been set to cover
131 | a wide range of applications. Your particular design
132 | may have different requirements, so please make the
133 | necessary adjustments and save your customized
134 | design rules under a new name.
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/hardware/lib/misc.lbr:
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106 | <b>RESISTOR</b>
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114 |
115 | >NAME
116 | >VALUE
117 |
118 |
119 |
120 |
121 |
122 | <B>Small Outline Narrow Plastic Gull Wing</B><p>
123 | 150-mil body, package type SN
124 |
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143 | >NAME
144 | >VALUE
145 | IPC SO8
146 | JEDEC MS-012 AA
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179 | >NAME
180 | >VALUE
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207 | >VALUE
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215 | >NAME
216 | >VALUE
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226 | >NAME
227 | >VALUE
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242 | >NAME
243 | >VALUE
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309 |
310 | Microchip: 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C
311 |
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--------------------------------------------------------------------------------
/hardware/lib/ftdi.lbr:
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61 |
62 | <b>48-pin plastic LQFP (FPT-48P-M26)</b><p>
63 | www.fma.fujitsu.com/pdf/e713717.pdf
64 |
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137 | >NAME
138 | >VALUE
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/hardware/20pin-adapter/20pin-adapter.brd:
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85 |
86 | FLOSSJTAG
87 | FLOSSJTAG
88 | CC-BY-SA
89 | CC-BY-SA
90 |
91 |
92 |
93 |
94 |
95 | <b>PIN HEADER</b>
96 |
97 |
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178 | 1
179 | >NAME
180 | >VALUE
181 | 20
182 |
183 |
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194 |
195 |
196 |
197 |
198 |
199 |
200 |
201 |
202 |
203 |
204 |
205 |
206 |
207 |
208 | <b>CONNECTOR</b><p>
209 | wire to board 1.25 mm (.049 inch) pitch header<p>
210 | SMT<p>
211 | right angle
212 |
213 |
214 |
215 |
216 |
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274 |
275 |
276 | >NAME
277 | >VALUE
278 | 1
279 |
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287 |
288 |
289 |
290 |
291 |
292 |
293 |
294 |
295 |
296 |
297 |
298 |
299 |
300 |
301 | <b>EAGLE Design Rules</b>
302 | <p>
303 | Die Standard-Design-Rules sind so gewählt, dass sie für
304 | die meisten Anwendungen passen. Sollte ihre Platine
305 | besondere Anforderungen haben, treffen Sie die erforderlichen
306 | Einstellungen hier und speichern die Design Rules unter
307 | einem neuen Namen ab.
308 | <b>EAGLE Design Rules</b>
309 | <p>
310 | The default Design Rules have been set to cover
311 | a wide range of applications. Your particular design
312 | may have different requirements, so please make the
313 | necessary adjustments and save your customized
314 | design rules under a new name.
315 |
316 |
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/hardware/20pin-adapter/20pin-adapter-teardrops.brd:
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85 |
86 | FLOSSJTAG
87 | FLOSSJTAG
88 | CC-BY-SA
89 | CC-BY-SA
90 |
91 |
92 |
93 |
94 |
95 | <b>PIN HEADER</b>
96 |
97 |
98 |
99 |
100 |
101 |
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178 | 1
179 | >NAME
180 | >VALUE
181 | 20
182 |
183 |
184 |
185 |
186 |
187 |
188 |
189 |
190 |
191 |
192 |
193 |
194 |
195 |
196 |
197 |
198 |
199 |
200 |
201 |
202 |
203 |
204 |
205 |
206 |
207 |
208 | <b>CONNECTOR</b><p>
209 | wire to board 1.25 mm (.049 inch) pitch header<p>
210 | SMT<p>
211 | right angle
212 |
213 |
214 |
215 |
216 |
217 |
218 |
219 |
220 |
221 |
222 |
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273 |
274 |
275 |
276 | >NAME
277 | >VALUE
278 | 1
279 |
280 |
281 |
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283 |
284 |
285 |
286 |
287 |
288 |
289 |
290 |
291 |
292 |
293 |
294 |
295 |
296 |
297 |
298 |
299 |
300 |
301 | <b>EAGLE Design Rules</b>
302 | <p>
303 | Die Standard-Design-Rules sind so gewählt, dass sie für
304 | die meisten Anwendungen passen. Sollte ihre Platine
305 | besondere Anforderungen haben, treffen Sie die erforderlichen
306 | Einstellungen hier und speichern die Design Rules unter
307 | einem neuen Namen ab.
308 | <b>EAGLE Design Rules</b>
309 | <p>
310 | The default Design Rules have been set to cover
311 | a wide range of applications. Your particular design
312 | may have different requirements, so please make the
313 | necessary adjustments and save your customized
314 | design rules under a new name.
315 |
316 |
317 |
318 |
319 |
320 |
321 |
322 |
323 |
324 |
325 |
326 |
327 |
328 |
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589 |
590 |
591 |
592 |
593 |
594 |
595 |
596 |
597 |
598 |
599 |
600 |
601 |
602 |
603 |
604 |
605 |
606 |
607 |
608 |
609 |
610 |
611 |
612 |
613 |
614 |
615 |
616 |
617 |
618 |
619 |
620 |
621 |
622 |
623 |
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