├── requirements.txt
├── CDXML.docx
├── CDXML.pptx
├── CDK-Checklist.xlsx
├── BQ27426Y2FT_validate.py
├── README.md
├── LICENSE
├── .gitignore
├── mdk.xsd
├── BQ27426YZFT.xml
├── tdk.xsd
├── adk.xsd
└── cdxml.xsd
/requirements.txt:
--------------------------------------------------------------------------------
1 | lxml
2 |
--------------------------------------------------------------------------------
/CDXML.docx:
--------------------------------------------------------------------------------
https://raw.githubusercontent.com/opencomputeproject/ODSA-CDXML/HEAD/CDXML.docx
--------------------------------------------------------------------------------
/CDXML.pptx:
--------------------------------------------------------------------------------
https://raw.githubusercontent.com/opencomputeproject/ODSA-CDXML/HEAD/CDXML.pptx
--------------------------------------------------------------------------------
/CDK-Checklist.xlsx:
--------------------------------------------------------------------------------
https://raw.githubusercontent.com/opencomputeproject/ODSA-CDXML/HEAD/CDK-Checklist.xlsx
--------------------------------------------------------------------------------
/BQ27426Y2FT_validate.py:
--------------------------------------------------------------------------------
1 | from lxml import etree
2 |
3 | xml_doc = etree.parse('BQ27426YZFT.xml')
4 |
5 | xmlschema_doc = etree.parse('cdxml.xsd')
6 | xmlschema = etree.XMLSchema(xmlschema_doc)
7 |
8 | result = xmlschema.validate(xml_doc)
9 |
10 |
--------------------------------------------------------------------------------
/README.md:
--------------------------------------------------------------------------------
1 | # Chiplet Data Exchange in XML Format (CDXML) #
2 | Chiplet Design Exchange (CDX) Workstream of ODSA focuses on electrical, mechanical, and thermal design exchange standards related to chiplets and integration in the context of multi chiplet modules, 2.5D and 3D Integrated Circuits (IC). This initial release of Chiplet Data Exchange in XML Format (CDXML) for but not limited to the following chiplets purposes:
3 | * Data exchange between different tools and formats
4 | * Design
5 | * Integration
6 | * Assembly rules
7 | * Mechanical characteristics
8 | * IO charateristics
9 | * Electrical characteristics
10 |
11 | This format is based on the zGlue Chiplets Info Exchange Format (ZEF) released with open-source copyright in 2019. As requested by the authors of ZEF, we acknowledge zGlue Inc for releasing ZEF in the open-source domain. All of the authors of ZEF have agreed to participate in developing this CDXML to replace the obsolete ZEF.
12 |
13 | CDX is promoting this chiplet model for wider usage through open initiatives. CDXML sets a foundation for the standard machine-readable description of Chiplets, in order to help automate design and business processes across companies when it comes to chiplet-based business ecosystems. The spirit of this disclosure is to encourage openness in an otherwise closed-source industry of chip design. CDX and OCP are releasing this license based on creative commons open source license. The developers of this document have agreed to adopt the OCP Creative Commons License for this format.
14 |
--------------------------------------------------------------------------------
/LICENSE:
--------------------------------------------------------------------------------
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/.gitignore:
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/BQ27426YZFT.xml:
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1 |
2 |
3 | U100540
4 | BQ27426
5 | BQ27426YZFT
6 | 1.0
7 | 2022-10-16
8 | 2022-10-16
9 |
10 |
11 | James Wong
12 |
13 |
14 |
15 | true
16 | 0
17 |
18 | 1550
19 | 1580
20 | 1610
21 |
22 |
23 | 1590
24 | 1620
25 | 1651
26 |
27 |
28 | 625
29 | 625
30 |
31 |
32 |
33 | 500
34 |
35 |
36 | 250
37 | 300
38 |
39 |
40 | 150
41 | 350
42 |
43 |
44 | 9
45 | 9
46 |
47 |
48 |
49 |
50 |
51 | A1
52 | GPOUT
53 | Digital Output
54 | Solder Ball
55 | BQ27426_GPOUT
56 | VDD
57 | VSS
58 |
59 | 0.1
60 |
61 |
62 | -500
63 | 500
64 |
65 |
66 | 300
67 |
68 |
69 | 6
70 |
71 |
72 | HBM
73 | 1500
74 |
75 |
76 |
77 | A1
78 | GPOUT
79 | Digital Output
80 | Solder Ball
81 | BQ27426_GPOUT
82 | VDD
83 | VSS
84 |
85 | 0.1
86 |
87 |
88 | -500
89 | 500
90 |
91 |
92 | 300
93 |
94 |
95 | 6
96 |
97 |
98 | HBM
99 | 1500
100 |
101 |
102 |
103 | A2
104 | SDA
105 | I2C
106 | Solder Ball
107 | BQ27426_SDA
108 | VDD
109 | VSS
110 |
111 | 0.1
112 |
113 |
114 | 0
115 | 500
116 |
117 |
118 | 300
119 |
120 |
121 | 6
122 |
123 |
124 | HBM
125 | 1500
126 |
127 |
128 |
129 | A3
130 | SCL
131 | Clock
132 | Solder Ball
133 | BQ27426_SCL
134 | VDD
135 | VSS
136 |
137 | 0.1
138 |
139 |
140 | 500
141 | 500
142 |
143 |
144 | 300
145 |
146 |
147 | 6
148 |
149 |
150 | HBM
151 | 1500
152 |
153 |
154 |
155 | B1
156 | BIN
157 | Digital Input
158 | Solder Ball
159 | BQ27426_BIN
160 | VDD
161 | VSS
162 |
163 | 0.1
164 |
165 |
166 | -500
167 | 0
168 |
169 |
170 | 300
171 |
172 |
173 | 6
174 |
175 |
176 | HBM
177 | 1500
178 |
179 |
180 |
181 | B2
182 | VSS
183 | Ground
184 | Solder Ball
185 | BQ27426_VSS
186 | VDD
187 | VSS
188 |
189 | 0.1
190 |
191 |
192 | 0
193 | 0
194 |
195 |
196 | 300
197 |
198 |
199 | 6
200 |
201 |
202 | HBM
203 | 1500
204 |
205 |
206 |
207 | B3
208 | VDD
209 | Power
210 | Solder Ball
211 | BQ27426_VDD
212 | VDD
213 | VSS
214 |
215 | 0.1
216 |
217 |
218 | 500
219 | 0
220 |
221 |
222 | 300
223 |
224 |
225 | 6
226 |
227 |
228 | HBM
229 | 1500
230 |
231 |
232 |
233 | C1
234 | SRP
235 | Digital Input
236 | Solder Ball
237 | BQ27426_SRP
238 | VDD
239 | VSS
240 |
241 | 0.1
242 |
243 |
244 | -500
245 | -500
246 |
247 |
248 | 300
249 |
250 |
251 | 6
252 |
253 |
254 | HBM
255 | 1500
256 |
257 |
258 |
259 | C2
260 | SRN
261 | Digital Input
262 | Solder Ball
263 | BQ27426_SRN
264 | VDD
265 | VSS
266 |
267 | 0.1
268 |
269 |
270 | 0
271 | -500
272 |
273 |
274 | 300
275 |
276 |
277 | 6
278 |
279 |
280 | HBM
281 | 1500
282 |
283 |
284 |
285 | C3
286 | BAT
287 | Power
288 | Solder Ball
289 | BQ27426_BAT
290 | VDD
291 | VSS
292 |
293 | 0.1
294 |
295 |
296 | 500
297 | -500
298 |
299 |
300 | 300
301 |
302 |
303 | 6
304 |
305 |
306 | HBM
307 | 1500
308 |
309 |
310 |
311 |
312 |
313 | HBM
314 | 1500
315 |
316 |
317 |
318 |
--------------------------------------------------------------------------------
/tdk.xsd:
--------------------------------------------------------------------------------
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195 |
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202 |
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205 |
206 |
207 |
208 |
209 |
210 |
211 |
212 |
213 |
214 |
215 |
216 |
217 |
218 |
219 |
220 |
221 |
222 |
223 |
224 |
225 |
226 |
227 |
228 |
229 |
230 |
231 |
--------------------------------------------------------------------------------
/adk.xsd:
--------------------------------------------------------------------------------
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7 |
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9 |
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81 |
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83 |
84 |
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86 |
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90 |
91 |
92 |
93 |
94 |
95 |
96 |
97 |
98 |
99 |
100 |
101 |
102 |
103 |
104 |
105 |
106 |
107 |
108 |
109 |
110 |
111 |
112 |
113 |
114 |
115 |
116 |
117 |
118 |
119 |
120 |
121 |
122 |
123 |
124 |
125 |
126 |
127 |
128 |
129 |
130 |
131 |
132 |
133 |
134 |
135 |
136 |
137 |
138 |
139 |
140 |
141 |
142 |
143 |
144 |
145 |
146 |
147 |
148 |
149 |
150 |
151 |
152 |
153 |
154 |
155 |
156 |
157 |
158 |
159 |
160 |
161 |
162 |
163 |
164 |
165 |
166 |
167 |
168 |
169 |
170 |
171 |
172 |
173 |
174 |
175 |
176 |
177 |
178 |
179 |
180 |
181 |
182 |
183 |
184 |
185 |
186 |
187 |
188 |
189 |
190 |
191 |
192 |
193 |
194 | Specifies the package type (e.g., Organic, Ceramic, PCB).
195 |
196 |
197 |
198 |
199 |
200 |
201 | Specifies the package size for substrate design.
202 |
203 |
204 |
205 |
206 |
207 |
208 |
209 |
210 |
211 |
212 |
213 |
214 | Defines the pitch of bump pads in micrometers.
215 |
216 |
217 |
218 |
219 | Specifies the diameter of the bump.
220 |
221 |
222 |
223 |
224 | Specifies the Under Bump Metallization (UBM) size.
225 |
226 |
227 |
228 |
229 | Specifies the bump composition (eutectic or lead-free).
230 |
231 |
232 |
233 |
234 |
235 |
236 |
237 |
238 |
239 |
240 |
241 |
242 |
243 | Defines the die pad coordinate direction (e.g., face up or face down).
244 |
245 |
246 |
247 |
248 |
249 |
250 |
251 |
252 |
253 |
254 | Specifies the chip size in millimeters.
255 |
256 |
257 |
258 |
259 |
260 | Specifies the chip thickness in micrometers.
261 |
262 |
263 |
264 |
265 |
266 |
267 |
268 |
269 |
270 |
271 |
272 |
273 | Defines the pitch of solder balls in micrometers.
274 |
275 |
276 |
277 |
278 |
279 |
280 |
281 |
282 |
283 |
284 | Specifies any special customer requirements, such as electrical, thermal, or warpage criteria.
285 |
286 |
287 |
288 |
289 |
290 |
291 |
292 |
--------------------------------------------------------------------------------
/cdxml.xsd:
--------------------------------------------------------------------------------
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244 |
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255 |
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261 |
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265 |
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267 |
268 |
269 |
270 |
271 |
272 |
273 |
274 |
275 |
276 |
277 |
278 |
279 |
280 |
281 |
282 |
283 |
284 |
285 |
286 |
287 |
288 |
289 |
290 |
291 |
292 |
293 |
294 |
295 |
296 |
297 |
298 |
299 |
300 |
301 |
302 |
303 |
304 |
305 |
306 |
307 |
308 |
309 |
310 |
311 |
312 |
313 |
314 |
315 |
316 |
317 |
318 |
319 |
320 |
321 |
322 |
323 |
324 |
325 |
326 |
327 |
328 |
329 |
330 |
331 |
332 |
333 |
334 |
335 |
336 |
337 |
338 |
339 |
340 |
341 |
342 |
343 |
344 |
345 |
346 |
347 |
348 |
349 |
350 |
351 |
352 |
353 |
354 |
355 |
356 |
357 |
358 |
359 |
360 |
--------------------------------------------------------------------------------